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M2S060T-1VFG400

400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-1VFG400
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 294
  • Description: 400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.There is a 400-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.Housed in the state-of-art Tray package.As a whole, this SoC part includes 207 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There is no safe voltage for the SoCs wireless above 1.26V.It can feed on a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.The system on a chip uses 400 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There is the option to have 207 outputs on this SoC chip.You will need to provide 1.2V power supplies in order to run system on chip.207 inputs are available on the SoC chip.The logic system on chips contain 56520 logic cells.It has a 256KB flash.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-1VFG400 System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • High-end PLC
  • Industrial transport
  • ARM processors
  • Cyberphysical system-on-chip
  • Healthcare
  • CNC control
  • External USB hard disk/SSD
  • Networked sensors
  • Industrial Pressure