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M2S060T-FCS325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-FCS325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 952
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Parameters
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.Housed in the state-of-art Tray package.As a whole, this SoC part is comprised of 200 inputs and outputs.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.There are 325 terminations in total and that really benefits system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.Using this SoC chip, you have the option of having 200 outputs.A power supply of 1.2V is required.A SoC chip with 200 inputs is available.There are 56520 logic cells in the logic system on chips.As for its flash size, it is 256KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060T-FCS325 System On Chip (SoC) applications.

  • Embedded systems
  • Networked Media Encode/Decode
  • System-on-chip (SoC)
  • Robotics
  • Mouse
  • Industrial Pressure
  • Efficient hardware for inference of neural networks
  • Smart appliances
  • Mobile market
  • Self-aware system-on-chip (SoC)