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M2S060T-FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 276
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 200 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.system on a chip benefits from 325 terminations.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip with 200 outputs is available.There is 1.2V power supply required for system on chip.Inputs are available on the SoC chip in the number of 200.System on chips of logic are comprised of 56520 logic cells.As for its flash size, it is 256KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060T-FCSG325 System On Chip (SoC) applications.

  • USB hard disk enclosure
  • Microprocessors
  • RISC-V
  • Vending machines
  • Efficient hardware for training of neural networks
  • Deep learning hardware
  • Optical drive
  • Automated sorting equipment
  • AC-input BLDC motor drive
  • Industrial Pressure