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M2S060T-FGG484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 108
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BGA to this system on a chip.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 267 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There is no safe voltage for the SoCs wireless above 1.26V.As long as it receives a power supply that is at least 1.14V, it should be able to function.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.There are 484 terminations in total and that really benefits system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There are 267 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 267 inputs available for use.System on chips of logic are comprised of 56520 logic cells.The flash is set to 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-FGG484 System On Chip (SoC) applications.

  • Central alarm system
  • Smartphones
  • Keywords
  • Networked sensors
  • Digital Signal Processing
  • Measurement testers
  • Mouse
  • ARM support modules
  • Industrial AC-DC
  • Communication network-on-Chip (cNoC)