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M2S060T-VFG400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060T-VFG400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 780
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.This system on a chip is packaged as 400-LFBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 207 I/Os.A 1.2V power supply is recommended.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 400 terminations, which is great for system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 207 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 207 inputs is available.System on chips of logic are comprised of 56520 logic cells.As for its flash size, it is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060T-VFG400I System On Chip (SoC) applications.

  • Three phase UPS
  • String inverter
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  • Remote control
  • Microcontroller based SoC ( RISC-V, ARM)
  • Video Imaging
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  • External USB hard disk/SSD
  • AC-input BLDC motor drive
  • Self-aware system-on-chip (SoC)