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M2S060TS-1FG484M

484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-1FG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 875
  • Description: 484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Flash Size 256KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).This system on a chip is packaged as 484-BGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -55°C~125°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 267 I/Os.A power supply with a 1.2V rating is recommended.There is no safe voltage for the SoCs wireless above 1.26V.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 484 terminations, so system on a chip is really aided by this.This flash has a size of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


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