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M2S060TS-1FGG676T2

-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 387 I/O

Manufacturer: Microsemi Corporation
Origchip NO: 523-M2S060TS-1FGG676T2
Package: 676-BGA
Datasheet: PDF
Stock: 612
Description: -40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 387 I/O(Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Package / Case	676-BGA
Supplier Device Package	676-FBGA (27x27)
Operating Temperature	-40°C~125°C TJ
Packaging	Tray
Series	Automotive, AEC-Q100, SmartFusion®2
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of I/O	387
Speed	166MHz
RAM Size	64KB
Core Processor	ARM® Cortex®-M3
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture	MCU, FPGA
Primary Attributes	FPGA - 60K Logic Modules
Flash Size	256KB
RoHS Status	RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Automotive, AEC-Q100, SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 387 I/Os.There is a flash of 256KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

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