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M2S060TS-1VFG400

400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-1VFG400
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 533
  • Description: 400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Package 400-LFBGA is assigned to this system on a chip by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 207 I/Os.A power supply with a 1.2V rating is recommended.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.As long as it receives a power supply that is at least 1.14V, it should be able to function.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 400 terminations in total and that really benefits system on a chip.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.Using this SoC chip, you have the option of having 207 outputs.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 207 inputs is available to the user.Logic system on chips features 56520 logic cells.The flash size of the SoC meaning is 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1VFG400 System On Chip (SoC) applications.

  • ARM Cortex M4 microcontroller
  • Samsung galaxy gear
  • Mobile market
  • Defense
  • Print Special Issue Flyer
  • Automotive
  • Industrial automation devices
  • Functional safety for critical applications in the aerospace
  • Microcontroller
  • Multiprocessor system-on-chips (MPSoCs)