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M2S060TS-FCS325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-FCS325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 877
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V (Kg)

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Details

Tags

Parameters
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B325
Number of Outputs 200
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 200
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.01mm
Length 11mm
Width 11mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 200 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 325 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.This SoC chip is capable of having 200 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.Inputs are available on the SoC chip in the number of 200.The logic system on chips contain 56520 logic cells.It has a 256KB flash.Aside from that, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060TS-FCS325 System On Chip (SoC) applications.

  • Wireless sensor networks
  • Mouse
  • Industrial AC-DC
  • Self-aware system-on-chip (SoC)
  • Smartphones
  • Automotive gateway
  • Medical
  • Transmitters
  • Industrial automation devices
  • Automotive