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M2S060TS-VFG400

400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S060TS-VFG400
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 300
  • Description: 400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 60K Logic Modules
Number of Logic Cells 56520
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 207 I/Os in total.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.It is really beneficial to have system on a chip since there are 400 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There are 207 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.This SoC chip has a total of 207 inputs that can be used.System on chips of logic are comprised of 56520 logic cells.There is a flash of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-VFG400 System On Chip (SoC) applications.

  • Industrial transport
  • Mobile market
  • Smart appliances
  • Cyber security for critical applications in the aerospace
  • Temperature Sensors
  • ARM Cortex M4 microcontroller
  • Healthcare
  • CNC control
  • Networked sensors
  • PC peripherals