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M2S090-1FG484

484 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090-1FG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 903
  • Description: 484 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 267
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 484-BGA package.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.It is important to note that this SoC security combines FPGA - 90K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 267 inputs and outputs.A power supply with a 1.2V rating is recommended.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 1.14V of power.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.There are 484 terminations in total and that really benefits system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 267 outputs, which is convenient.This system on chip SoC requires 1.2V power supply at all.267 inputs are available on the SoC chip.86316 logic cells are included in logic system on chips.A 512KB flash can be seen on it.Searching M2S090 will bring up system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090-1FG484 System On Chip (SoC) applications.

  • Automotive
  • Deep learning hardware
  • Three phase UPS
  • Print Special Issue Flyer
  • String inverter
  • ARM support modules
  • Industrial automation devices
  • Video Imaging
  • High-end PLC
  • Flow Sensors