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M2S090-1FGG676I

676 Terminations-40°C~100°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090-1FGG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 728
  • Description: 676 Terminations-40°C~100°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

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Details

Tags

Parameters
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 425
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Matte Tin (Sn)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 676-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 676 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.As for its flash size, it is 512KB.M2S090 will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090-1FGG676I System On Chip (SoC) applications.

  • Networked sensors
  • Functional safety for critical applications in the aerospace
  • Functional safety for critical applications in the industrial sectors
  • System-on-chip (SoC)
  • Flow Sensors
  • Industrial Pressure
  • Industrial automation devices
  • Test and Measurement
  • DC-input BLDC motor drive
  • String inverter