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M2S090-FG484

484 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090-FG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 456
  • Description: 484 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 267
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The SmartFusion?2 series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 267.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.It can feed on a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.As a result, there are 484 terminations in total, which does really benefit system on a chip.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.It is possible to use this SoC chip with 267 outputs.There is 1.2V power supply requirement for this system on chip SoC.A SoC chip with 267 inputs is available to the user.A logic SoC has 86316 logic cells.A flashing 512KB appears on it.M2S090 will give you system on chips with similar specifications and purposes.The wireless SoC works at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090-FG484 System On Chip (SoC) applications.

  • Apple smart watch
  • Microcontroller
  • Multiprocessor system-on-chips (MPSoCs)
  • Networked sensors
  • Measurement tools
  • Mobile computing
  • Print Special Issue Flyer
  • sequence controllers
  • ARM
  • RISC-V