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M2S090-FG676

676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090-FG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 525
  • Description: 676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 425
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines FPGA - 90K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part includes 425 I/Os.Use a power supply with a voltage of 1.2V if possible.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.Power supply should be at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 676 terminations, so system on a chip is really aided by this.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There are 425 outputs available on this SoC.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 425 inputs that can be used.A logic SoC has 86316 logic cells.This flash has a size of 512KB.You can get system on chips with similar specs and purposes by searching M2S090.In this wireless SoC, the frequency is set to 166MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090-FG676 System On Chip (SoC) applications.

  • Cyberphysical system-on-chip
  • Deep learning hardware
  • Industrial automation devices
  • Cyber security for critical applications in the aerospace
  • PC peripherals
  • Smart appliances
  • Published Paper
  • Special Issue Information
  • ARM Cortex M4 microcontroller
  • Measurement testers