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M2S090-FGG484

484 Terminations0°C~85°C TJ 484 Pin M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090-FGG484
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 178
  • Description: 484 Terminations0°C~85°C TJ 484 Pin M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090
Number of Outputs 267
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Supply Voltage-Max (Vsup) 1.26V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 267
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Its package is 484-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.A state-of-the-art Tray package houses this SoC system on a chip.267 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.A SoC chip like this can have 267 outputs.A logic SoC has 86316 logic cells.This flash has a size of 512KB.M2S090 will give you system on chips with similar specifications and purposes.In this wireless SoC, the frequency is set to 166MHz.It uses ARM as its core architecture.The computer SoC is available in 484-pin form.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090-FGG484 System On Chip (SoC) applications.

  • Three phase UPS
  • Networked Media Encode/Decode
  • Level
  • Healthcare
  • Digital Media
  • Microprocessors
  • Mobile market
  • Wireless networking
  • Industrial automation devices
  • Servo drive control module