M2S090-FGG484I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 484-BGA.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.The SoC design uses MCU, FPGA architecture for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 267 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which is great for system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There is the option to have 267 outputs on this SoC chip.A power supply of 1.2V is required to run system on chip.A SoC chip with 267 inputs is available.Logic system on chips consist of 86316 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation

M2S090-FGG484I System On Chip (SoC) applications.

• Servo drive control module
• Avionics
• Embedded systems
• Communication interfaces ( I2C, SPI )
• Robotics
• Networked sensors
• Temperature
• Communication network-on-Chip (cNoC)
• Measurement testers
• CNC control