M2S090S-1FG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Manufacturer assigns package 676-BGA to this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.425 I/Os in total are included in this SoC part.There is a flash of 512KB.A search for M2S090S will result in system on chips that have similar specs and purposes.In this wireless SoC, the frequency is set to 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.For the SoC computing to start, -40°C is sufficient.There is an operating temperature limit of 100°C which is the maximum operating temperature designed for this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S090S-1FG676I System On Chip (SoC) applications.

• Networked Media Encode/Decode
• Communication network-on-Chip (cNoC)
• POS Terminals
• Sensor network-on-chip (sNoC)
• Digital Media
• Central alarm system
• Industrial Pressure
• POS Terminals
• Medical
• Samsung galaxy gear