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M2S090T-1FCS325I

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090T-1FCS325I
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 929
  • Description: 325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 1.16mm
Length 13.5mm
Width 11mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).It has been assigned a package 325-TFBGA, CSPBGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The SmartFusion?2 series contains this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 180 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.It can feed on a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 325 terminations.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 180 outputs.There is 1.2V power supply required for system on chip.On the SoC chip, there are 180 inputs available for use.There are 86316 logic cells in the logic system on chips.A flashing 512KB appears on it.Aside from that, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S090T-1FCS325I System On Chip (SoC) applications.

  • POS Terminals
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  • Industrial automation devices
  • Microcontroller based SoC ( RISC-V, ARM)
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  • Special Issue Information
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