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M2S090T-1FG484M

484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090T-1FG484M
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 396
  • Description: 484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V (Kg)

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Details

Tags

Parameters
Height Seated (Max) 2.44mm
Length 23mm
Width 23mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Surface Mount YES
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A001.A.2.C
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 267
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 267
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -55°C~125°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 267 inputs and outputs.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.In the SoCs wireless, voltages above 1.26V are considered unsafe.There is a possibility that it can be powered by a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 484 terminations, which is great for system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 267 outputs.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip is equipped with 267 inputs for the user to choose from.The logic system on chips contain 86316 logic cells.A flashing 512KB appears on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090T-1FG484M System On Chip (SoC) applications.

  • Test and Measurement
  • ARM
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  • Efficient hardware for inference of neural networks
  • Flow Sensors
  • Digital Signal Processing
  • DC-input BLDC motor drive
  • Industrial transport
  • Temperature Sensors
  • Apple smart watch