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M2S090T-FG676

676 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090T-FG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 127
  • Description: 676 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S090T
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 425
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 90K Logic Modules together.It comes in a state-of-the-art Tray package.In total, this SoC part has 425 I/Os.It is advised to utilize a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 676 terminations, which is great for system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 425 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.There are 425 inputs available on the SoC chip.The logic SoC features 86316 logic cells.This flash has a size of 512KB.A search for M2S090T will result in system on chips that have similar specs and purposes.During operation, the wireless SoC runs at a frequency of 166MHz.It uses ARM as its core architecture.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090T-FG676 System On Chip (SoC) applications.

  • Published Paper
  • Vending machines
  • Defense
  • Microcontroller
  • Medical
  • Body control module
  • Smartphones
  • Fitness
  • Smart appliances
  • Automotive