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M2S090T-FGG676I

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090T-FGG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 570
  • Description: 676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 425
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Manufacturer assigns package 676-BGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines FPGA - 90K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 425 inputs and outputs.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supplies of at least 1.14V are required.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 676 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.There are 425 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.This SoC chip is equipped with 425 inputs for the user to choose from.There are 86316 logic cells in the logic system on chips.The flash is set to 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090T-FGG676I System On Chip (SoC) applications.

  • Industrial robot
  • Networked sensors
  • Smart appliances
  • Deep learning hardware
  • Automotive gateway
  • Industrial automation devices
  • POS Terminals
  • Flow Sensors
  • Industrial automation devices
  • Smartphones