M2S090TS-1FGG676

This SoC is built on ARM? Cortex?-M3 core processor(s).

This SoC is built on ARM? Cortex?-M3 core processor(s).The manufacturer assigns this system on a chip with a 676-BGA package.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.It is important to note that this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.This SoC part has a total of 425 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.system on a chip benefits from 676 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation

M2S090TS-1FGG676 System On Chip (SoC) applications.

• Temperature
• Temperature Sensors
• Robotics
• Fitness
• Smart appliances
• Remote control
• ARM support modules
• Automotive gateway
• Industrial automation devices
• Vending machines