M2S090TS-1FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 676-BGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.425 I/Os are available in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.It is really beneficial to have system on a chip since there are 676 terminations in total.This flash has a size of 512KB.By searching M2S090TS, you will find system on chips with similar specs and purposes.At 166MHz, the wireless SoC works.It uses ARM as its core architecture.The computer SoC has 676 pins.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S090TS-1FGG676I System On Chip (SoC) applications.

• Keyboard
• System-on-chip (SoC)
• Samsung galaxy gear
• Three phase UPS
• Apple smart watch
• Healthcare
• Sensor network-on-chip (sNoC)
• POS Terminals
• Avionics
• Transmitters