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  • M2S090TS-1FGG676T2

M2S090TS-1FGG676T2

-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 425 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090TS-1FGG676T2
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 865
  • Description: -40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 425 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 676-BGA
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series Automotive, AEC-Q100, SmartFusion®2
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 425
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Flash Size 512KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Manufacturer assigns package 676-BGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the Automotive, AEC-Q100, SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.Taking note of the fact that this SoC security combines FPGA - 90K Logic Modules is important.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 425 I/Os.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.It has a 512KB flash.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


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