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M2S090TS-FCSG325

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090TS-FCSG325
  • Package: 325-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 994
  • Description: 325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 325-TFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B325
Number of Outputs 180
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 180
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 180
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 1.16mm
Length 13.5mm
Width 11mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.There is one thing to note about this SoC security: it combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.In total, this SoC part has 180 I/Os.A 1.2V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.At least 1.14V can be supplied as a power source.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.As a result, there are 325 terminations in total, which does really benefit system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 180 outputs, which is convenient.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 180.System on chips of logic are comprised of 86316 logic cells.The flash is set to 512KB.Further features of this SoC processor are LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S090TS-FCSG325 System On Chip (SoC) applications.

  • Functional safety for critical applications in the aerospace
  • Networked sensors
  • Published Paper
  • Microprocessors
  • Central inverter
  • AC drive control module
  • Robotics
  • Video Imaging
  • Industrial automation devices
  • Transmitters