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M2S090TS-FGG484I

-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S090TS-FGG484I
  • Package: 484-BGA
  • Datasheet: PDF
  • Stock: 643
  • Description: -40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O(Kg)

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Shipping Cost

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BGA
Supplier Device Package 484-FPBGA (23x23)
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 267
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 90K Logic Modules
Flash Size 512KB
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.There is a 484-BGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Internally, this SoC design uses the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.It is important to note that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 267.A 512KB flash can be seen on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090TS-FGG484I System On Chip (SoC) applications.

  • Smartphones
  • Industrial automation devices
  • Functional safety for critical applications in the aerospace
  • Communication network-on-Chip (cNoC)
  • Video Imaging
  • Microcontroller
  • Networked sensors
  • Mobile market
  • Automated sorting equipment
  • Efficient hardware for training of neural networks