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M2S100-1FCG1152I

-40°C~100°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S100-1FCG1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 801
  • Description: -40°C~100°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S100
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Number of Logic Cells 99512
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 100K Logic Modules, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.574 I/Os are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.You can have 574 user outputs for this SoC chip.There is 1.2V power supply required for system on chip.A SoC chip with 574 inputs is available.Logic system on chips features 99512 logic cells.There is a flash of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S100.During operation, the wireless SoC runs at a frequency of 166MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100-1FCG1152I System On Chip (SoC) applications.

  • Industrial sectors
  • Remote control
  • Vending machines
  • Keyboard
  • ARM support modules
  • Efficient hardware for inference of neural networks
  • Deep learning hardware
  • Networked sensors
  • USB hard disk enclosure
  • Transmitters