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M2S100-FCG1152

0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S100-FCG1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 636
  • Description: 0°C~85°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S100
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 100K Logic Modules
Number of Logic Cells 99512
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the SmartFusion?2 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be 0°C~85°C TJ.In addition, this SoC security combines FPGA - 100K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.574 I/Os in total are included in this SoC part.A power supply with a 1.2V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.This SoC chip is capable of having 574 outputs, which is convenient.You will need to provide 1.2V power supplies in order to run system on chip.There are 574 inputs available on the SoC chip.99512 logic cells are included in logic system on chips.This flash has a size of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S100.During operation, the wireless SoC runs at a frequency of 166MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S100-FCG1152 System On Chip (SoC) applications.

  • Central alarm system
  • External USB hard disk/SSD
  • Industrial
  • Central inverter
  • Functional safety for critical applications in the industrial sectors
  • Transmitters
  • Medical Pressure
  • Industrial sectors
  • RISC-V
  • Robotics