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M2S150-1FC1152

0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150-1FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 261
  • Description: 0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.This system on a chip is packaged as 1152-BBGA, FCBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.In addition, this SoC security combines FPGA - 150K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 574.A power supply with a 1.2V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 574 outputs.You will need to provide 1.2V power supplies in order to run system on chip.On the SoC chip, there are 574 inputs available for use.The logic system on chips contain 146124 logic cells.A flashing 512KB appears on it.M2S150 will give you system on chips with similar specifications and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S150-1FC1152 System On Chip (SoC) applications.

  • Central alarm system
  • Print Special Issue Flyer
  • AC drive control module
  • Three phase UPS
  • Multiprocessor system-on-chips (MPSoCs)
  • Mobile market
  • Industrial sectors
  • Sports
  • Vending machines
  • Industrial robot