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M2S150-1FCV484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150-1FCV484I
  • Package: 484-BFBGA
  • Datasheet: PDF
  • Stock: 246
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V (Kg)

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Details

Tags

Parameters
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 273
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 273
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 3.15mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.273 I/Os in total are included in this SoC part.It is recommended to use a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 484 terminations, so system on a chip is really aided by this.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There is the option to have 273 outputs on this SoC chip.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 273 inputs is available.A logic SoC has 146124 logic cells.This flash has a size of 512KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150-1FCV484I System On Chip (SoC) applications.

  • Digital Signal Processing
  • Video Imaging
  • Wireless sensor networks
  • sequence controllers
  • Measurement tools
  • Cyber security for critical applications in the aerospace
  • String inverter
  • Servo drive control module
  • Efficient hardware for training of neural networks
  • Microprocessors