M2S150-FC1152I

This SoC is built on ARM? Cortex?-M3 core processor(s).

Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Its package is 1152-BBGA, FCBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 574 I/Os.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.On the SoC chip, there are 574 inputs available for use.There are 146124 logic cells in the logic system on chips.A flashing 512KB appears on it.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation

M2S150-FC1152I System On Chip (SoC) applications.

• Mobile computing
• Three phase UPS
• Digital Media
• Samsung galaxy gear
• Sensor network-on-chip (sNoC)
• Body control module
• Fitness
• Medical
• Robotics
• Apple smart watch