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M2S150-FCG1152

0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150-FCG1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 678
  • Description: 0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status RoHS Compliant
Lead Free Lead Free
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Package 1152-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.There are 574 outputs available on this SoC.As far as power supplies are concerned, system on chip requires 1.2V.On the SoC chip, there are 574 inputs available for use.146124 logic cells are included in logic system on chips.This flash has a size of 512KB.By searching M2S150, you can find system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 166MHz.In terms of core architecture, the SoC meaning relies on ARM.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S150-FCG1152 System On Chip (SoC) applications.

  • Smartphones
  • Test and Measurement
  • Multiprocessor system-on-chips (MPSoCs)
  • POS Terminals
  • Wireless networking
  • Sports
  • Efficient hardware for inference of neural networks
  • Functional safety for critical applications in the automotive
  • Healthcare
  • Industrial sectors