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M2S150-FCV484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150-FCV484
  • Package: 484-BFBGA
  • Datasheet: PDF
  • Stock: 737
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 12 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 273
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 273
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 3.15mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.Its package is 484-BFBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion?2 is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.In addition, this SoC security combines FPGA - 150K Logic Modules.Tray package houses this SoC system on a chip.273 I/Os are available in this SoC part.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.As a result, there are 484 terminations in total, which does really benefit system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.It is possible to use this SoC chip with 273 outputs.In order to use system on chip, you will need a power supply of 1.2V.Inputs are available on the SoC chip in the number of 273.In logic system on chips, there are 146124 logic cells.As for its flash size, it is 512KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150-FCV484 System On Chip (SoC) applications.

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