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M2S150T-1FCS536

536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-1FCS536
  • Package: 536-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 528
  • Description: 536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 536-LFBGA, CSPBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 536
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B536
Number of Outputs 293
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 293
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 293
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.There is a 536-LFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 150K Logic Modules.It is packaged in a state-of-the-art Tray package.293 I/Os in total are included in this SoC part.Ideally, a power supply with a voltage of 1.2V should be used.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supply should be at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.There are 536 terminations in total and that really benefits system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.A SoC chip with 293 outputs is available.System on chip requires 1.2V power supplies.This SoC chip has a total of 293 inputs that can be used.The logic SoC features 146124 logic cells.There is a flash of 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150T-1FCS536 System On Chip (SoC) applications.

  • AC drive control module
  • Video Imaging
  • AC-input BLDC motor drive
  • Industrial AC-DC
  • Sensor network-on-chip (sNoC)
  • Communication interfaces ( I2C, SPI )
  • System-on-chip (SoC)
  • Automotive
  • High-end PLC
  • Three phase UPS