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M2S150T-1FCV484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-1FCV484
  • Package: 484-BFBGA
  • Datasheet: PDF
  • Stock: 212
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 273
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 273
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 3.15mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 150K Logic Modules.Tray package houses this SoC system on a chip.This SoC part has a total of 273 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.If it has at least a 1.14V volt power supply, it can work fine.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.Having 484 terminations in total makes system on a chip possible.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.This SoC chip is capable of having 273 outputs, which is convenient.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip is equipped with 273 inputs for the user to choose from.System on chips of logic are comprised of 146124 logic cells.This flash has a size of 512KB.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150T-1FCV484 System On Chip (SoC) applications.

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