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M2S150T-1FCVG484I

484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-1FCVG484I
  • Package: 484-BFBGA
  • Datasheet: PDF
  • Stock: 473
  • Description: 484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 484-BFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 273
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 273
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 3.15mm
Length 19mm
Width 19mm
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.It has been assigned a package 484-BFBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 273 I/Os in total.A 1.2V power supply is recommended.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is really beneficial to have system on a chip since there are 484 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.There are 273 outputs available on this SoC.There is 1.2V power supply required for system on chip.A SoC chip with 273 inputs is available to the user.146124 logic cells are included in logic system on chips.The flash size of the SoC meaning is 512KB.Additionally, this SoC processor features LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150T-1FCVG484I System On Chip (SoC) applications.

  • Temperature Sensors
  • AC drive control module
  • Defense
  • Optical drive
  • Smart appliances
  • Industrial transport
  • High-end PLC
  • Self-aware system-on-chip (SoC)
  • Wireless sensor networks
  • sequence controllers