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M2S150T-FC1152

0°C~85°C TJ M2S150T System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 779
  • Description: 0°C~85°C TJ M2S150T System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150T
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series SmartFusion®2
JESD-609 Code e0

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.It is a member of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 150K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 574 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.It can feed on a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 574 inputs is available to the user.The logic system on chips contain 146124 logic cells.There is a flash of 512KB on it.By searching M2S150T, you can find system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.In this SoC meaning, ARM serves as the core architecture.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

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