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M2S150T-FCSG536I

536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-FCSG536I
  • Package: 536-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 191
  • Description: 536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 536-LFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 536
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B536
Number of Outputs 293
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 293
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 293
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
RoHS Status RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 536-LFBGA, CSPBGA package.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the SmartFusion?2 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 150K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.293 I/Os are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There is no safe voltage for the SoCs wireless above 1.26V.In order to run it, it must be fed by at least 1.14V of power.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.In total, there are 536 terminations, which makes system on a chip possible.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 293 outputs.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip is equipped with 293 inputs.The logic system on chips contain 146124 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150T-FCSG536I System On Chip (SoC) applications.

  • Temperature Sensors
  • Networked sensors
  • Industrial AC-DC
  • Industrial automation devices
  • Communication interfaces ( I2C, SPI )
  • Special Issue Editors
  • Video Imaging
  • Deep learning hardware
  • PC peripherals
  • Microcontroller