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M2S150T-FCV484

484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150T-FCV484
  • Package: 484-BFBGA
  • Datasheet: PDF
  • Stock: 167
  • Description: 484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 484-BFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B484
Number of Outputs 273
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 273
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 273
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 3.15mm
Length 19mm
Width 19mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 484-BFBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion?2 is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 150K Logic Modules and that is something to note.Tray package houses this SoC system on a chip.273 I/Os in total are included in this SoC part.It is recommended to use a 1.2V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.It can feed on a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.The system on a chip uses 484 terminations in total.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There is the option to have 273 outputs on this SoC chip.A power supply of 1.2V is required.On the SoC chip, there are 273 inputs available for use.System on chips of logic are comprised of 146124 logic cells.There is a flash of 512KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S150T-FCV484 System On Chip (SoC) applications.

  • Industrial
  • Robotics
  • Deep learning hardware
  • Efficient hardware for training of neural networks
  • Remote control
  • Sports
  • Apple smart watch
  • ARM
  • Medical
  • Functional safety for critical applications in the automotive