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M2S150TS-1FC1152I

-40°C~100°C TJ M2S150TS System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150TS-1FC1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 315
  • Description: -40°C~100°C TJ M2S150TS System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150TS
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Number of I/O 574
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 1152-BBGA, FCBGA to this system on a chip.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the SmartFusion?2 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A key point to note is that this SoC security combines FPGA - 150K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.574 I/Os are included in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.At least 1.14V can be supplied as a power source.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.Using this SoC chip, you have the option of having 574 outputs.This system on chip SoC requires 1.2V power supply at all.This SoC chip has a total of 574 inputs that can be used.Logic system on chips consist of 146124 logic cells.There is a flash of 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S150TS.At 166MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S150TS-1FC1152I System On Chip (SoC) applications.

  • Central alarm system
  • ARM support modules
  • Functional safety for critical applications in the automotive
  • Multiprocessor system-on-chips (MPSoCs)
  • Video Imaging
  • Communication interfaces ( I2C, SPI )
  • Robotics
  • ARM Cortex M4 microcontroller
  • AC-input BLDC motor drive
  • Smartphones