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M2S150TS-FC1152

0°C~85°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S150TS-FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 661
  • Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 574
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines FPGA - 150K Logic Modules.An advanced Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.There are 574 outputs available on this SoC.You will need to provide 1.2V power supplies in order to run system on chip.574 inputs are available on the SoC chip.A logic SoC has 146124 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150TS-FC1152 System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Smart appliances
  • Networked sensors
  • Microcontroller
  • Optical drive
  • Industrial transport
  • Mouse
  • Communication interfaces ( I2C, SPI )
  • Communication network-on-Chip (cNoC)
  • Automotive