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MAX3736ETE

0.5mm PMIC 3.3V 16-WFQFN Exposed Pad


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MAX3736ETE
  • Package: 16-WFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 542
  • Description: 0.5mm PMIC 3.3V 16-WFQFN Exposed Pad (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 16-WFQFN Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Type Laser Diode Driver (Fiber Optic)
Terminal Finish TIN LEAD
Technology BIPOLAR
Voltage - Supply 2.97V~3.63V
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 16
Qualification Status COMMERCIAL
Number of Channels 1
Current - Supply 22mA
Data Rate 3.2Gbps
Current - Modulation 85mA
Current - Bias 100mA
Height Seated (Max) 0.8mm
Length 3mm
Width 3mm
RoHS Status Non-RoHS Compliant

MAX3736ETE Overview


It is packaged based on Tray's materials.This device is well known in the electronics industry for its low package cost.Applications of standard grade qualify it as Type Laser Diode Driver (Fiber Optic). 1 channels are configured for data transmission.A voltage of 2.97V~3.63V is provided to ensure the unit's normal operation.Surface Mount is used to mount it on the PCB.As a result, it runs at the temperature of -40°C~85°C in order to achieve high efficiency.Programming with 16 terminations is used.Using 3.3V as the supply voltage, this system works.The board is equipped with 16 pins for a variety of applications.22mA is used as the supply current in this system.

MAX3736ETE Features


Supplied in the 16-WFQFN Exposed Pad package
Operating temperature of -40°C~85°C

MAX3736ETE Applications


There are a lot of Rochester Electronics, LLC MAX3736ETE Laser Driver ICs applications.

  • Ethernet condition monitoring vibration sensor
  • Gateway module
  • RF (Radio Frequency)
  • Smartcard
  • Low Noise Instrumentation
  • HMI (Human-Machine Interface)
  • Battery-powered device
  • Pressure sensor
  • SoC
  • Car window lift