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MAX5956BUEE

2 Hot Swap Controllers SSOP 2


  • Manufacturer: Maxim Integrated
  • Origchip NO: 503-MAX5956BUEE
  • Package: SSOP
  • Datasheet: PDF
  • Stock: 922
  • Description: 2 Hot Swap Controllers SSOP 2 (Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case SSOP
Number of Pins 16
Published 2011
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 1
Number of Terminations 16
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Subcategory Power Management Circuits
Technology BICMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 0.635mm
Pin Count 16
Temperature Grade COMMERCIAL EXTENDED
Number of Channels 2
Max Supply Voltage 13.2V
Min Supply Voltage 1V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Nominal Supply Current 1.2mA
Adjustable Threshold YES
Height Seated (Max) 1.75mm
Length 4.9mm
Width 3.9mm
Radiation Hardening No
RoHS Status RoHS Compliant

MAX5956BUEE Overview


This is included in the SSOP package.Currently, 2 channels can be accessed.The 16 terminations total to three.DUAL is the terminal position of the device.16 pins make up the entire device.The supply voltage 5V is necessary for high efficiency.During operation, 16 pins are used.This gadget is self-contained in?Power Management Circuits.There is a Surface Mount-axis orientation to it.For stable operation, the maximum operating temperature should be 85°C°C.The system must function at a minimum temperature of 0°C degrees Celsius in order to maintain its reliability.An analog IC, POWER SUPPLY SUPPORT CIRCUIT in this instance, is used for this gadget.A maximum supply voltage of 13.2VV can be handled by it.With 1VV, it can work with the lowest supply voltage possible.

MAX5956BUEE Features


The terminal position of 16

MAX5956BUEE Applications


There are a lot of Maxim Integrated MAX5956BUEE hot swap controllers applications.

  • Industrial application
  • Other forms of communications infrastructure
  • Datacom
  • Storage network
  • Current monitoring
  • Reverse current protection
  • Temperature monitor output
  • Network switch
  • Disconnect faulty loads before supply voltage drops
  • Board or blade insertion into live backplanes