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MC100EP16FDT

Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MC100EP16FDT
  • Package: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Datasheet: PDF
  • Stock: 858
  • Description: Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supplier Device Package 8-TSSOP
Operating Temperature -40°C~85°C
Packaging Tube
Published 2008
Series 100EP
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 3V~5.5V
Logic Type Differential Receiver/Driver
RoHS Status Non-RoHS Compliant

MC100EP16FDT Overview


Packaging is done using Tube.The package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) includes it.Providing a voltage of 3V~5.5V ensures proper function of the device.Electronic parts mounted using the Surface Mount method.This device operates at a temperature of -40°C~85°C.Electronic parts belonging to the 100EP series share a number of characteristics.

MC100EP16FDT Features



MC100EP16FDT Applications


There are a lot of Rochester Electronics, LLC MC100EP16FDT Specialty Logic ICs applications.

  • VoIP phones
  • Digital systems
  • Gigabit Ethernet
  • IP cameras
  • Wireless communication
  • Desktop radio
  • Satellite communications networks
  • Laser diode bonding
  • Precision geodetic measurement
  • Wireless security systems