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MC100EP16VBDTR2G

Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-MC100EP16VBDTR2G
  • Package: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Datasheet: PDF
  • Stock: 842
  • Description: Differential Receiver/Driver -40°C~85°C Specialty Logic IC 100EP Series 3V~5.5V 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Supplier Device Package 8-TSSOP
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Series 100EP
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 3V~5.5V
Logic Type Differential Receiver/Driver
RoHS Status ROHS3 Compliant

MC100EP16VBDTR2G Overview


It is used to package items using Tape & Reel (TR).You can find it in package 8-TSSOP, 8-MSOP (0.118, 3.00mm Width).3V~5.5V is provided to ensure that the device works normally.Electronic parts mounted in the way of Surface Mount are referred to as this type.Temperature -40°C~85°C is set as operating temperature.Electronic parts from the 100EP series share a number of similarities.

MC100EP16VBDTR2G Features



MC100EP16VBDTR2G Applications


There are a lot of Rochester Electronics, LLC MC100EP16VBDTR2G Specialty Logic ICs applications.

  • Remote controls
  • Televisions
  • interconnection between computers
  • Wireless showroom
  • LAN, SAN, WAN (local, storage, work area networks)
  • Structural bonding
  • Solenoids
  • Digital systems
  • Fast Ethernet
  • Wireless 3D game