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MC33FS6502CAE

1V~5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33FS6502CAE
  • Package: 48-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 330
  • Description: 1V~5V Specialized Power Management ICs(Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tray
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant

MC33FS6502CAE Overview


Tray is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.Among other applications, this power management targets System Basis Chip .To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .The power management operates at 1V~5V volts.

MC33FS6502CAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6502CAE Applications


There are a lot of NXP USA Inc. MC33FS6502CAEPower Management applications.

  • System Thermal for PCs
  • Electronic Test Equipment
  • Automotive cluster
  • HSTL Termination
  • Tablet PCs
  • Digital Signage
  • Optical imaging payload
  • Isolated DC-DC Modules
  • Hardware Monitoring for Servers
  • SmartPhones