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  • MC33FS6502LAER2

MC33FS6502LAER2

1V~5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33FS6502LAER2
  • Package: 48-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 908
  • Description: 1V~5V Specialized Power Management ICs(Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 16 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS Status ROHS3 Compliant

MC33FS6502LAER2 Overview


It is acceptable to ship in the way of Tape & Reel (TR) .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management works at 1V~5V voltage.

MC33FS6502LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6502LAER2 Applications


There are a lot of NXP USA Inc. MC33FS6502LAER2Power Management applications.

  • FPGA
  • LP2996A: DDR2
  • Power Factor Correction
  • FPGA
  • Electronic Test Equipment
  • Networking Equipment
  • Peripheral I/O Power
  • LP2996A: DDR1
  • Electronic Test Instrumentation
  • Digital Cores