Products
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Width | Mounting Type | Operating Temperature | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Current-Max | Input Voltage-Nom | Analog IC - Other Type | Applications | Supply Current-Max (Isup) | Adjustable Threshold | Input Voltage (Min) | Input Voltage (Max) | Telecom IC Type | Voltage - Supply | Control Technique | Switcher Configuration | Switching Frequency-Max |
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MC33PF8101A0ESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | 260 | 40 | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8 Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||
MC32PF3000A8EP | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2014 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 48-VFQFN Exposed Pad | Surface Mount | -40°C~85°C | 8542.39.00.01 | NOT SPECIFIED | NOT SPECIFIED | POWER SUPPLY SUPPORT CIRCUIT | i.MX Processors | 2.8V~5.5V | |||||||||||||||||||||||||||||||||||||
MC33664ATL1EG | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tube | 2014 | Active | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~125°C TA | 40mA | 260 | 40 | Isolated Communications Interface | INTERFACE CIRCUIT | 4.5V~5.5V | ||||||||||||||||||||||||||||||||||||||
MC34VR500V8ESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56 | EAR99 | 8mm | ROHS3 Compliant | ALSO OPRTS W/T CONTROL TECH PFM; ALSO OPRTS IN ADJ MODE FROM 0.625 TO 1.975V | 56-VFQFN Exposed Pad | 8mm | Surface Mount | -40°C~105°C TA | 2A | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | NOT SPECIFIED | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N56 | 13.7A | 3.6V | SWITCHING REGULATOR | QorlQ LS1/T1 Communications Processors | 2.8V | 4.5V | 2.8V~4.5V | PULSE WIDTH MODULATION | BUCK | 4000kHz | |||||||||||||||||||
MC33FS6510LAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33814AE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
18 Weeks | Tray | 2004 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 10mA | 8542.39.00.01 | e3 | Matte Tin (Sn) | 260 | 40 | MC33814 | ANALOG CIRCUIT | Small Engine | 4.5V~36V | ||||||||||||||||||||||||||||||||||
MC35FS6510CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MWCT1R24ZVHT | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tray | Active | 3 (168 Hours) | TELECOM CIRCUIT | ||||||||||||||||||||||||||||||||||||||||||||||||
MC34PF8100EPEPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||||
MC33FS8410G3ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) | ||||||||||||||||||||||||||||||||||||||||||||||||||
MC33FS6503NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC34PF8100A0EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||
MC33FS4500LAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6502LAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS4501NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS4502NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6503CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6511CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC33FS6502NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC34PF8100CHEPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||||||||||
MC33FS6511NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC13892DJVL | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
12 Weeks | Tray | 2004 | Active | 3 (168 Hours) | 186 | EAR99 | 12mm | ROHS3 Compliant | 186-LFBGA | 12mm | Surface Mount | -40°C~85°C | 1.6mm | 8542.39.00.01 | 1 | BOTTOM | BALL | 260 | 3.6V | NOT SPECIFIED | MC13892 | YES | 0.8mm | S-PBGA-B186 | 1.8V | 1 | Power Management Circuits | Not Qualified | 3.6V | 3.6V | POWER SUPPLY MANAGEMENT CIRCUIT | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | 1.5mA | YES | |||||||||||||||||||
MC34PF8100CCEPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||||
MC33PF8100CHESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||||
MC34FS6407NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tray | 2015 | Active | 3 (168 Hours) | EAR99 | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 13mA | 8542.39.00.01 | NOT SPECIFIED | NOT SPECIFIED | System Basis Chip | ETHERNET TRANSCEIVER | 2.7V~36V | ||||||||||||||||||||||||||||||||||||
MC35FS6512NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC34PF8100F3EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||||||||
MC35FS6501CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | |||||||||||||||||||||||||||||||||||||||
MC35FS4502CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | System Basis Chip | 1V~5V | ||||||||||||||||||||||||||||||||||||||||||
MC34VR500V3ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2011 | Active | 3 (168 Hours) | 56 | EAR99 | 8mm | ROHS3 Compliant | ALSO OPRTS W/T CONTROL TECH PFM; ALSO OPRTS IN ADJ MODE FROM 0.625 TO 1.975V | 56-VFQFN Exposed Pad | 8mm | Surface Mount, Wettable Flank | -40°C~105°C TA | 250μA | 0.9mm | 8542.39.00.01 | 1 | e3 | Tin (Sn) | QUAD | NO LEAD | 260 | 40 | YES | 0.5mm | S-XQCC-N56 | Power Management Circuits | Not Qualified | 2.8/4.5V | 13.7A | 3.6V | SWITCHING REGULATOR | QorlQ LS1/T1 Communications Processors | 2.8V | 4.5V | 2.8V~4.5V | PULSE WIDTH MODULATION | BUCK | 4000kHz |
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