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MC33PF8100CCES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8100CCES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 253
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Details

Tags

Parameters
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS Status ROHS3 Compliant

MC33PF8100CCES Overview


The way of Tray is acceptable for shipping the power management.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .It is intended to be used at High Performance i.MX 8, S32x Processor Based as well as for other applications.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.For its operation, this power management requires 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.

MC33PF8100CCES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8100CCES Applications


There are a lot of NXP USA Inc. MC33PF8100CCESPower Management applications.

  • HSTL Termination
  • Cluster
  • Telecom Rectifiers
  • Debug
  • Servers
  • LP2996A: DDR1
  • SmartPhones
  • LTE modem
  • Field Service
  • Industrial Telemetry Applications