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MC33PF8200DAES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-MC33PF8200DAES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 107
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V

MC33PF8200DAES Overview


The way of Tray is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.This power management uses 2.5V~5.5V voltage for work.

MC33PF8200DAES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8200DAES Applications


There are a lot of NXP USA Inc. MC33PF8200DAESPower Management applications.

  • Camera Power Applications
  • Automotive camera module
  • Portable Systems
  • Applications Processors
  • Surround view system ECU
  • Automotive cluster
  • LTE modem
  • Hand-Held Systems
  • System Thermal for PCs
  • Telecom Rectifiers